Our in-house process is mechanical wafer dicingĪt Die Devices we offer a mechanical wafer dicing service which is suitable for a broad range of semiconductor materials. An extreme highest quality outcome is required where price is no object.The wafer physically requires specialist singulation which these methods can provide.Processing volumes exceed the trade-off point between price and throughput versus traditional dicing costs.Specialist wafer dicing methods such as LASER and chemical etch are typically useful when: This is largely due to cost effectiveness in terms of throughput, cost of ownership and setup flexibility. The most prevalent methods in use today are mechanical wafer dicing and scribe & break. Scribe & break (Fragile or hard compound & opto).There are several wafer dicing methods in the industry: The wafer dicing process is critical in that it is a majority contributor to mechanical quality and by default has an impact on yield, the number of good die per wafer. Pass wafer level test + Pass visual post processing = Bare Die considered good (relative to the electrical test performed). The baseline quality for a bare die is that it passes electrical test at wafer level and passes visual inspection after the singulation and handling process into the shipping media. Mechanical quality - Assessed by visual inspection either automated or manual.Electrical test - Please see here for our wafer testing capabilities.There are two principle aspects in getting good bare die product into assembly:

Dicing saw chipping